Viability of Vibration Technology Printing

Over the past 3 years, Milara has been tasked to prove the viability of our vibration squeegee technology to a variety of LARGE contract manufacturers involved in general product applications to cell phone developers. Embarking on this mission, we set out to prove that our patented vibration squeegee is not simply another “gimmick” in the market place. The information below is a general summary of what we had to PROVE to these large business entities in regards to printing viability WITH and WITHOUT vibration squeegee technology.


.3mm CSP Printing


Milara conducted viability print testing on a .3mm CSP application. The objective was to print with optimal results to obtain a 100 percent throughput with no voids. The testing criteria were to provide information post printing with and without our patented vibration technology. Our actual result proved a marked improvement between printing with vibration and without. The results shown below are print pad height (Figure 1), area (Figure 2) and, most important, volume (Figure 3).


Overall height without/with vibration

Figure 1: Overall height without/with vibration


This comparison shows a far better distribution closer to the target line using vibration technology. Using vibration provides the paste height much closer to the nominal value (101.6 μm) whereas using the non-vibration technique, the height of the solder paste is much higher than the target that may be bridging.


Overall height without/with vibration

Figure 2: .3mm Area without/with vibration


Overall height without/with vibration

Figure 3: .3mm Volume without/with vibration


The test indicates that there is a significant advantage in using vibration over non-vibration technique.


Vibration provides better pad coverage (transfer efficiency). Transfer efficiency is a calculation of the percentage of solder paste printed into the aperture that is printed onto the printed circuit board pad.


01005 Printing


Milara was also tasked to perform the same printing tests similar to the .3mm CSP application, replacing the PCB with one that was specifically focused on 01005 component sized technology. The following is presented:


Test Criteria

  • Perform a non-printed, 10 repeat test 3D analysis on a bare board to gather “zero” data
  • Setup printer with the following parameters:


                       Print speed – 1.0 inch /second

                       Print Pressure – 15 psi

  • Bottom side cleaning – manual, no automation after EACH print
  • Run 10 board print test WITH vibration
  • Run 10 boards in SE300 for 3D analysis immediately after printing
  • Run 10 board print test with NO vibration
  • Run 10 boards in SE300 for 3D analysis immediately after printing


For the ease of comparison between Vibration and Non Vibration Technology, the data is divided based on the Land Pattern (L) (Figure 4) and Pad Area ( b x c) (Figure 5). 


Overall height without/with vibration

Figure 4: The test board


Overall height without/with vibration

Figure 5: Pad area


The Height comparison (Figure 6), with and without Vibration technology, shows that Vibration technology has a significant effect (approximately 50%) for small pad area.


01005 HEIGHT COMPARISON


Overall height without/with vibration

Figure 6: 01005 Printing height without/with vibration


The Area comparison (Figure 7), with and without Vibration technology, shows that Vibration technology has a significant effect (approximately 10%) on larger pad areas.


01005 AREA COMPARISON


01005 Printing area without/with vibration

Figure 7: 01005 Printing area without/with vibration


The Volume comparison (Figure 8), with and without Vibration technology, shows that Vibration technology has a significant effect (approximately 40%) for small pad areas.


01005 VOLUME COMPARISON


01005 Printing volume without/with vibration

Figure 8: 01005 Printing volume without/with vibration


01005 Printing CONCLUSION



  • Using vibration provides the paste height of approximately 50% higher for pads with smaller pad area whereas for larger pad area the non-vibration technique provides much higher solder paste height than the target that may be bridging.

  • Vibration provides approximately 8% better area coverage for pads with large pad area compared to non-vibration technology

  • Transfer efficiency is a calculation of the percentage of solder paste printed into the aperture that is printed onto the printed circuit board pad. Vibration provides approximately 40% better transfer efficiency for smaller pad area when compared to non-vibration technology.