Semiconductor Systems

Over years of development for our SMT line of products, all critical technologies used in alignment and printing processes were developed and “acid tested” with out semiconductor systems. From a fully capable wafer bumping process module incorporating our robot wafer handlers and prealigners to our manual wafer printing and bumping systems, Milara has a product to meet your wafer printing or bumping needs as a cost effective solution to other technologies such as expensive wafer plating or ball dropping systems.

AWPb 300 Fully Automated Wafer Bumping System Milara's first fully automated wafer bumping system capable of handling 150, 200 and 300mm wafers. This fully operational cell incorporates a full EFEM module combined with wafer bumping process module to yield a fully closed process solution.
SemiTouch Wafer Auto Vision Batch Printer (STWAV) Using high precision optics and the same dual servo loop vision positioning system found on our SMT products, this system can wafer solder and flux print competing with ALL those high end systems and we have the data to prove it!
SemiTouch STW-1 Wafer Printing / Bumping System Flexible lower cost manual alignment wafer printer / wafer bumping system (yes, dual capability) that can easily changeover between both applications.
MiniTouch MTW-1 Wafer Bumping System The first wafer bumping system developed by Milara in cooperation with Flip Chip, K&S back in 1998. This product, utilized by the largest semiconductor packaging firms in the world, has single handedly bumped billions of dollars of wafers over its tenure and is still going strong today!
BGA 1000 and 2000 Series Flux / Reballing Desktop System For BGA fluxing and ball dropping, this small yet cost effective manual flux dropper is perfect for R&D laboratories for low volume applications. This system is so easy to use yet simplistic in overall design.