EQUIPE PRE-200 Series - Advanced Non-Contact Wafer Pre-Aligner

EQUIPE PRE-200 Series

Advanced Non-Contact Wafer Pre-Aligner

General Info:

Wafers sized from 3" to 8" (76mm to 200mm) are centered and aligned without mechanical changes or readjustments.

The Pre-Aligner automatically senses if the wafer has a flat, notch or major/minor flats. There is even optional software that enables the user to align square substrates.

Other features include direct encoder feedback on the wafer chuck and a highly linear light source providing optimal illumination to the Charged Coupled Device (CCD) sensor. Full servo control of each of the three axes provides smooth, fast motions. Used with the ESC-200 controller, with its high speed CPU and high resolution servo, x/y precision is better than +/-.002" and theta precision is better than +/-.04 degrees. Reliability is one of the PRE-200's strongest suits. With very few moving parts and high ESD tolerance, MTBF numbers are greater than 65,000 hours. Combined with the ATM robot, the PRE-200 Pre-Aligner completes your wafer-handling picture. Specifications

Axes of Motion Radial axis: X/Y Offset

Theta axis: Rotation Chuck

Z-axis: Raise and Lower Pins
Repeatability Theta: +/-04° (3 Sigma)

X/Y Alignment: +/-. 002” (+/-50 Micron)(3 Sigma)
Wafer Diameter Range 3"-8" (76mm-200mm)
Cleanliness Class 1 cleanroom compatible
Maximum Offset 9mm or .36”
Flat & Notch Compatibility Optical, Non-Contact
Drive DC Servo
Chuck Vacuum Wafer Retention
Pins Vacuum Wafer Retention
Communication RS-232
Throughput Fast Align 4 Sec. (Typical) Normal 8 Sec. (Typical)
Utilities Required Vacuum: 20” Hg     Power: 200 VA; 100-240 VAC; 50/60 Hz