Diamond H5 Wafer Handling Robot - Vacuum

Diamond H5 Wafer Handling Robot - Vacuum

Wafer Size 2” (50mm) to 12” (300mm)

Payload 1.2 kg (2.65 lbs)

Encoders Absolute, 32768 pulse/rev on motor shaft Motor type Brushless, low inertia high response

Weight 29.5 kg (65 lbs) without an end-effector

Cleanliness Class 1 clean room environment compatible

Operating temperatures 50°F-104°F (10°C to 40°C)

Facility requirements Voltage range 100-120AVC, 200-240VAC

Axis Motion range Max Velocity Max Acceleration Axis Repeatability
T >500° 180 °/s 360 °/s2 ±0.01°
R ±19.883” 25 inch/s 35 inch/s2 ±0.001” (0.025mm)
Z 1.456” 4 inch/s 12 inch/s2 ±0.001” (0.025mm)