Diamond H5 Wafer Handling Robot - Vacuum
Wafer Size 2” (50mm) to 12” (300mm)
Payload 1.2 kg (2.65 lbs)
Encoders Absolute, 32768 pulse/rev on motor shaft Motor type Brushless, low inertia high response
Weight 29.5 kg (65 lbs) without an end-effector
Cleanliness Class 1 clean room environment compatible
Operating temperatures 50°F-104°F (10°C to 40°C)
Facility requirements Voltage range 100-120AVC, 200-240VAC
| Axis | Motion range | Max Velocity | Max Acceleration | Axis Repeatability |
|---|---|---|---|---|
| T | >500° | 180 °/s | 360 °/s2 | ±0.01° |
| R | ±19.883” | 25 inch/s | 35 inch/s2 | ±0.001” (0.025mm) |
| Z | 1.456” | 4 inch/s | 12 inch/s2 | ±0.001” (0.025mm) |
