Diamond H4 Wafer Handling Robot

Wafer Size 2”(50mm) to 12”(300mm)

Payload 2.2 lbs (1.0 kg) per arm

Encoders Incremental, 10.000 pulse/rev Motor type Brushless, low inertia high response

Weight 84 lbs (38.1 kg)

Cleanliness Class 1 clean room environment compatible

Operating temperatures 50°F-104°F (10°C to 40°C)

Facility requirements Voltage range 100-120AVC, 200-240VAC Vacuum supply 11.8” Hg (-5.8psi) / 0.1CFM airflow

Axis	Motion range	Max Velocity	Max Acceleration	Axis Repeatability
T	> 390°	400 °/s	1500 °/s2	±0.01°
R1, R2	±13.6”	50 inch/s	300 inch/s2	±0.001” (0.025mm)
Z	13”	18 inch/s	44 inch/s2	±0.001” (0.025mm)

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