Diamond H4 Wafer Handling Robot
Diamond H4 Wafer Handling Robot
Wafer Size 2”(50mm) to 12”(300mm)
Payload 2.2 lbs (1.0 kg) per arm
Encoders Incremental, 10.000 pulse/rev Motor type Brushless, low inertia high response
Weight 84 lbs (38.1 kg)
Cleanliness Class 1 clean room environment compatible
Operating temperatures 50°F-104°F (10°C to 40°C)
Facility requirements Voltage range 100-120AVC, 200-240VAC Vacuum supply 11.8” Hg (-5.8psi) / 0.1CFM airflow
| Axis | Motion range | Max Velocity | Max Acceleration | Axis Repeatability |
|---|---|---|---|---|
| T | > 390° | 400 °/s | 1500 °/s2 | ±0.01° |
| R1, R2 |
±13.6” | 50 inch/s | 300 inch/s2 | ±0.001” (0.025mm) |
| Z | 13” | 18 inch/s | 44 inch/s2 | ±0.001” (0.025mm) |
