Diamond H4 Wafer Handling Robot

Diamond H4 Wafer Handling Robot

Wafer Size 2”(50mm) to 12”(300mm)

Payload 2.2 lbs (1.0 kg) per arm

Encoders Incremental, 10.000 pulse/rev Motor type Brushless, low inertia high response

Weight 84 lbs (38.1 kg)

Cleanliness Class 1 clean room environment compatible

Operating temperatures 50°F-104°F (10°C to 40°C)

Facility requirements Voltage range 100-120AVC, 200-240VAC Vacuum supply 11.8” Hg (-5.8psi) / 0.1CFM airflow

Axis Motion range Max Velocity Max Acceleration Axis Repeatability
T > 390° 400 °/s 1500 °/s2 ±0.01°
R1,

R2
±13.6” 50 inch/s 300 inch/s2 ±0.001” (0.025mm)
Z 13” 18 inch/s 44 inch/s2 ±0.001” (0.025mm)