Diamond H3 Wafer Handling Robot

Diamond H3 Wafer Handling Robot

Wafer Size 2”(50mm) to 12”(300mm)

Payload 2.2 lbs (1.0 kg)

Encoders Incremental, 10.000 pulse/rev Motor type Brushless, low inertia high response

Weight 62 lbs (28 kg) for 13” vert. travel, and 7.2”x7.2” arm

Operating temperatures 50°F-104°F (10°C to 40°C)

Facility requirements Voltage range 100-120AVC, 200-240VAC Vacuum supply 11.8” Hg(-5.8psi) / 0.1CFM airflow

Axis Motion range Max Velocity Max Acceleration Axis Repeatability

T

> 360°

(typical +/-230°)
360 °/s 1500 °/s² ±0.01°

R

From ±10.5”

Up to ±17.5”

(depending on arm)
Up to 50 inch/s

(depending on arm size)
300 inch/s² ±0.001”

(0.025mm)

Z

From 13” up to 21” (depending on robot body model) 18 inch/s 44 inch/s² ±0.001”

(0.025mm)