Milara Receives Coveted Industry Award for Its Bumping System

Medway, MA — January 26, 2007 — Milara Inc., a leading vendor of fully and semiautomatic stencil printers for SMT and semiconductor applications, announces that it has been awarded a SMT VISION Award in the category of Printing Equipment for its innovative AWPb 300 Automatic Wafer Bumping System. The crystal glass award will be presented to Krassimir Petkov, CEO, during a Monday, February 19, 2007 ceremony that will take place at the Wilshire Grand Hotel in Los Angeles before the start of APEX.

Milara takes its combined system technology practice one step further with the development of the AWPb 300 Wafer Bumper system. The system is a creative and cost efficient application of Milara’s existing technology and is capable of handling 150, 200 and 300mm cassettes with either a single or dual FOUP option. A single robotic arm with pre-aligner is used to load and unload wafers onto the automated print stage (EFEM). Using Milara’s patented vibration squeegee technology, which has proven viability in wafer bumping, the AWPb 300 uses the same technology used by all Milara printers to accomplish ultra-fine-pitch printing (down to 29 μm) with 100 percent printing reliability (no missed apertures on wafers with excess of 44,000 per print) in conjunction with unsurpassed solder brick geometry.

The AWPb 300 fully automatic robotic wafer bumper offers advanced technological features and combines them with unprecedented ease of operation at one low price. Windows™-based programming simplifies every aspect of setup. A software allows both first time and experienced operators to use the printer’s full capabilities in just a sort time. The AWPb 300 is engineered to provide significant speed and throughput improvements by achieving the highest levels of precision and consistency in paste deposition. Self-diagnostic software is utilized for instant troubleshooting to ensure maximum productivity as well as to simplify maintenance and increase repairability.

The new In Print Area (IPA) wafer wiping squeegee system operates separately from the two main print squeegees although located in the same print area. If wafer gasket printing is used, the final residual cleaning wipes of the wafer can be produced within the print area eliminating paste on wafer bottom and edge. The AWPb 300 accomplishes this operation by incorporating a tri-blade vibrating wiper system. After moving the cleaning squeegees back and forth, the wafer is effectively wiped six times in approximately six seconds. The small amounts of solder paste on the squeegee blades are removed with the ultrasonic cleaning and the blades are 100 percent clean for the next wiping cycle. The bumping system is very environmentally conscious. Hazardous waste disposal is simplified by incorporating Milara’s own non-toxic, biodegradable, non-flammable, water-based cleaning fluid. Wiper frequency, stroke and ultrasonic clean time are fully programmable.

Now in its 15th year, the SMT VISION Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology in 22 key areas are chosen by a distinguished panel of industry experts.