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SEMICON Taiwan 2008, at the Taipei World Trade Center (TWTC), Taipei, Hall 1, September 9-11, Booth #1114 of Sigmatek Corporation
Located at: 5 Hsinyi road, Sec. 5 Taipei 110, Taiwan
Press Release:
Milara Inc., a leading vendor of fully and semiautomatic stencil printers for SMT and semiconductor applications, announces that it will introduce AWPb 300 automatic wafer bumping system complete with new OCR wafer inspection. Milara will also introduce its new robotics division with the following product debuts:
4X Equipment Front End Module
Milara has completed the development of our new 4X equipment front end module (4X EFEM). This very versatile design allows robotic wafer handling to access 3 of a 4 sided access design in which semiconductor fabricators can apply multiple processes to a single station. Wafer FOUP handling and prealigning referencing are accomplished within the 4X in which the wafer can now be presented to other fab processes such as wafer bumping, oven reflow and or wafer washing. By utilizing this principal in a front end module, valuable production floor space savings can be achieved.
Milara Robot Handling Products
Milara has partnered with a servo robotics design company to now offer high end robotic positioning, handling and pre-alignment equipment. Using the same precision servo motion control hardware used in its printer products, Milara is proud to offer this technology for individualized robotic motion control applications.
These robots are class-1 clean room compatible. The modular concept guarantees a maximum of flexibility and capability. The advanced servo controllers provide a seamless integration of linear tracks and other peripherals. The internal controllers ensure smooth running along multiple path segments. Wafer operation and script programming language provides for optimal emulation of third party software enabling integration of most semiconductor tools.
Wafer Prealigners
The Milara prealigners are high precision, class 1 compatible solutions including scanning electronics, motion controller and power supply within an industry standard footprint. All axes are servo driven and equipped with ultra low inertia brushless motors for smooth, instant response. The advanced scanning heads are capable of detecting transparent, semi-transparent and opaque objects with diameters of 2“(50 mm) up to 12“(300 mm) without repositioning between different wafer sizes. The aligning cycle time of less than 3.5 seconds allows achieving maximum throughput.
Milara also offers various wafer handling end effectors.
