Diamond H4 Wafer Handling Robot

Wafer Size
2”(50mm) to 12”(300mm)

Payload
2.2 lbs (1.0 kg) per arm

Encoders
Incremental, 10.000 pulse/rev

Motor type
Brushless, low inertia high response

Weight
84 lbs (38.1 kg)

Cleanliness
Class 1 clean room environment compatible

Operating temperatures
50°F-104°F (10°C to 40°C)

Facility requirements
Voltage range
100-120AVC, 200-240VAC
Vacuum supply
11.8” Hg (-5.8psi) / 0.1CFM airflow

Axis	Motion range	Max Velocity	Max Acceleration	Axis Repeatability
T	> 390°	400 °/s	1500 °/s2	±0.01°
R1, R2	±13.6”	50 inch/s	300 inch/s2	±0.001” (0.025mm)
Z	13”	18 inch/s	44 inch/s2	±0.001” (0.025mm)