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Milara can manufacture products to customers’ own designs and specifications. We can support new product introductions and flexibly augment your own manufacturing capabilities. Additionally, we can usually redesign existing products for transfer from other coating facilities, retaining their essential performance properties.
Milara is very experienced in working with long term partners to co-develop products via collaborative R&D projects. The basis of these joint development agreements is that Milara becomes the principal supplier of these products to the customer.
Milara (HTI) co-pioneered the first wafer bumping printer with FlipChip (Kuliche and Soffa) in 1998 which utilizes the vibration squeegee technology to effectively fill silicon wafer bumps. Milara is the first systems company Flip Chip (K&S) specified within their licensed process for wafer bumping