Milara Incorporated would like to take this opportunity to provide the following information on our fully automatic in-line stencil printing system.

First new radically designed printing system in over 18 years (no new product designs for over a decade from any competitor)

• Complete System Modularity (single platform vs. multiple machines)
• Higher accuracy to handle tomorrow’s tighter tolerances
• Improved durability and higher production throughput (improved equipment ROI)
• Flexible solutions with future upgradeability (combined technology (print and dispense))
• Environmentally engineered to eliminate all hazardous waste
• Innovative design concepts

Milara takes its combined system technology practice one step further with the development of the new SemiTouch Wafer Printer system (STW-1). The system is capable of both wafer stencil printing and bumping within a single system. The STW-1 is molded after our standard SemiTouch printer and by pressing a single button, the system converts itself from a wafer bumper to a stencil printer in seconds. Milara has incorporated a new vision system with accuracies of 12um, which yields the capability of ultra fine pitch printing. Utilizing our patented vibration squeegee technology which has proven viability in wafer bumping, the STW-1 employs the same technology to accomplish ultra fine pitch printing (down to 29um) with 100 percent printing reliability (no missed apertures on wafers with excess of 25,000 per print) in conjunction with unsurpassed solder brick geometry.

The STW-1 semi-automatic wafer printer offers advanced technological features and combines them with unprecedented ease of operation. Windows™ based programming simplifies every aspect of set-up. A customized windows based system allows either first time or experienced operators to use the printer’s full capabilities in just a short time. The STW-1 is engineered to achieve the highest levels of precision and consistency in paste deposition. A self-diagnostic program for instant trouble shooting is built in to ensure maximum productivity.

Milara has been setting the industry standard for printers by combining highly skilled technical expertise with ingenious product design and adding the most important element of all – customer input.

Milara takes its combined system technology practice one step further with the development of the new AWPb 300 Wafer Printer / Bumper system. The system is capable of handling 150, 200 and 300mm wafers with either a dual or single FOUP option. A single robotic arm with pre-aligner is used to load and unload wafers onto the automated print stage (EFEM). Utilizing our patented vibration squeegee technology which has proven viability in wafer bumping, the AWPb 300 employs the same technology used by all Milara printers to accomplish ultra fine pitch printing (down to 29um) with 100 percent printing reliability in conjunction with unsurpassed solder brick geometry.