EQUIPE PRE-200 Series
Advanced Non-Contact Wafer Pre-Aligner
Wafers sized from 3″ to 8″ (76mm to 200mm) are centered and aligned without mechanical changes or readjustments.
The Pre-Aligner automatically senses if the wafer has a flat, notch or major/minor flats. There is even optional software that enables the user to align square substrates.
General Info:
Other features include direct encoder feedback on the wafer chuck and a highly linear light source providing optimal illumination to the Charged Coupled Device (CCD) sensor. Full servo control of each of the three axes provides smooth, fast motions. Used with the ESC-200 controller, with its high speed CPU and high resolution servo, x/y precision is better than +/-.002″ and theta precision is better than +/-.04 degrees. Reliability is one of the PRE-200’s strongest suits. With very few moving parts and high ESD tolerance, MTBF numbers are greater than 65,000 hours. Combined with the ATM robot, the PRE-200 Pre-Aligner completes your wafer-handling picture.
Features:
MTBF 65,000 hours, Class 1 clean room compatible, Two independent Radial Axis, Compact Footprint
Highly repeatable positioning, Macro programmable, Intelligent Commands, Available for both: Pin-Load (PRE-201) models ; Chuck Load (PRE-200) models, CE Mark available, Fast-Scan high-throughput (option), Ultra-clean option available
Specification:
| Axes of Motion | Radial axis: X/Y Offset
Theta axis: Rotation Chuck Z-axis: Raise and Lower Pins |
|---|---|
| Repeatability | Theta: +/-04° (3 Sigma)
X/Y Alignment: +/-. 002” (+/-50 Micron)(3 Sigma) |
| Wafer Diameter Range | 3″-8″ (76mm-200mm) |
| Cleanliness | Class 1 clean-room compatible |
| Maximum Offset | 9mm or .36” |
| Flat & Notch Compatibility | Optical, Non-Contact |
| Drive | DC Servo |
| Chuck | Vacuum Wafer Retention |
| Pins | Vacuum Wafer Retention |
| Communication | RS-232 |
| Throughput | Fast Align 4 Sec. (Typical) Normal 8 Sec. (Typical) |
| Utilities Required | Vacuum: 20” Hg Power: 200 VA; 100-240 VAC; 50/60 Hz |
| Axis | Motion Range | Axis repeatability |
|---|---|---|
| T | Rotate Chuck | – .04° (3 Sigma) |
| R | Used for X/Y Offset | X/Y Alignment : – 0.002” ( +/- 50 Micron) (3 σ) |
| Z | Raise and Lower Pins | N/A |