Over years of development for our SMT line of products, all critical technologies used in alignment and printing processes were developed and “acid tested” with out semiconductor systems. From a fully capable wafer bumping process module incorporating our robot wafer handlers and prealigners to our manual wafer printing and bumping systems, Milara has a product to meet your wafer printing or bumping needs as a cost effective solution to other technologies such as expensive wafer plating or ball dropping systems.
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