MiniTouch MTW-1 Wafer Bumping System
General Description
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The MiniTouch semi-automatic wafer bumper offers advanced technological features and combines them with unprecedented ease of operation and is engineered to achieve the highest levels of precision and consistency in operation.
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A self-diagnostic program for instant trouble shooting is built in to ensure maximum productivity.
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Milara has been setting the industry standard for printers by combining highly skilled technical expertise with ingenious product design and adding the most important element of all - customer input!
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Patented and proven vibration squeegee technology (certified by Flip Chip Technology)
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Simplified control panel with Windows™ Professional
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Fast, easy set-up and alignment
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Rugged industrial control components for high reliability
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The MiniTouch Wafer Printer (MTW-1) is engineered to achieve the highest levels of precision and consistency in paste deposition. A self-diagnostic program for instant trouble shooting is built in to ensure maximum productivity.
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Milara has been setting the industry standard for printers by combining highly skilled technical expertise with ingenious product design.
Featured Benefits
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Print area 14” x 16”
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Specialized wafer chuck plate fabrication
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Advance vacuum chuck monitoring system with auto abort function
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Servo shuttle style X, Y and Theta carriage
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X, Y, and Theta adjustments
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Programmable squeegee speed and positions
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Integrated resistive touchscreen for easy setup
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Last wafer recall and unlimited wafer profile storage
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Step through programming for new operators
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Advanced programming for experienced operators
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Self-diagnostic system to provide instant problem solving
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Closed loop, microprocessor controlled squeegee pressure
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Bottom side stencil wiper
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Top side wafer wiper
Mechanical Specifications
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14” x 16” (355mm x 406mm) |
| Wafer Frame: | 8” x 10” up to 20” x 20” (203mm x 254mm up to 508mm x 508mm) |
| Registration Repeatability: | +/- 0.0005” (+/- 12µm) |
| Wafer Size: | 6” to 8” (150mm to 200mm, 300mm available) |
| “X” “Y” Adjustment: | +/- 0.75” (+/- 19mm) |
| Theta Adjustment: | +/- 10 degrees |
| Squeegee Head Print Stroke: | 1” to 17” (25mm to 432mm) |
| Squeegee Head Speed: | 0.1” to 9.9” per second (2.5mm to 250mm per sec.) |
| Wafer Height Adjustment: | 0.50” range (12.7mm range) |
| Squeegee Pressure: | 1 to 65 pounds (0.50 to 29 Kilos) |
| Dimensions: | 65” L x 44” W x 52” H (165cm x 111.8cm x 132.1cm) |
| Shipping Weight: | 600 pounds (272 kilos) |