Diamond H4 Wafer Handling Robot
Manufactured by Milara Inc. USA and Designed by Logosol Inc. USA (www.logosolinc.com)
Wafer Size 2”(50mm) to 12”(300mm)
Payload 2.2 lbs (1.0 kg) per arm
Encoders Incremental, 10.000 pulse/rev Motor type Brushless, low inertia high response
Weight 84 lbs (38.1 kg)
Cleanliness Class 1 clean room environment compatible
Operating temperatures 50°F-104°F (10°C to 40°C)
Facility requirements Voltage range 100-120AVC, 200-240VAC Vacuum supply 11.8” Hg (-5.8psi) / 0.1CFM airflow
Axis | Motion range | Max Velocity | Max Acceleration | Axis Repeatability |
---|---|---|---|---|
T | > 390° | 400 °/s | 1500 °/s2 | ±0.01° |
R1,
R2 |
±13.6” | 50 inch/s | 300 inch/s2 | ±0.001” (0.025mm) |
Z | 13” | 18 inch/s | 44 inch/s2 | ±0.001” (0.025mm) |